Quality Control Laboratory

High-definition appearance inspection includes screen printing, coding, and high-definition inspection of solder balls to confirm that the solder balls in the BGA package are in good condition, including oxidation, re-soldering, flatness, and consistency. Whether the product surface is the same as the specification mark, oxidation or counterfeit parts can be detected.

. During functional testing, the functional comparator compares the voltage level of the DUT output signal with the VOL and VOH reference levels. Output gating assigns a timing value to each output pin to control the precise point during the test cycle at which the output voltage is sampled.

Open/short testing (also called continuity or contact testing) verifies that all signal pins on the DUT make electrical contact during device testing and that no signal pin is shorted to another signal pin or to power/ground. During functional testing, the functional comparator compares the voltage level of the DUT output signal to the VOL and VOH reference levels. Output gating assigns a timing value to each output pin to control the precise point during the test cycle at which the output voltage is sampled.

checks the read, erase and program functions of the chip and blank check, including digital memory, microcontroller, microcontroller, etc.

X-rays can confirm whether wafer to wire bonding and chip bonding are good; ROHS testing is through photovoltaic equipment for environmental protection of product pins and lead content of solder coating.

integrated circuit products need to be stripped by dipping, first to remove the surface of the epoxy resin product, and secondly to remove the gold and wafer. Therefore, high-definition microscopes can display the original records, defects, and quality of wafers to understand the causes of faulty products.